[17a-S4_203-1~11] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17a-S4_203-5] Study of Micro-electrode Patterns on the Control of the Electroplated Metal Deposition toward MEMS Device Fabrication

〇Kota Sakanashi¹, Tomoyuki Kurioka¹, Katsuyuki Machida¹, Chen Chun-Yi¹, Chang Tso-Fu Mark¹, Yoshihiro Miyake¹, Hiroyuki Ito¹, Masato Sone¹ (1.Science Tokyo)

Keywords:

electroplating,current density distribution,electroplated copper films

This paper describes the evaluation of the relationship between patterns of the micro-electrodes forming the working electrode and copper electroplating process by finite element analysis. Effects of the micro-electrode patterns on the growth of the electroplated copper film is investigated. The distribution of copper ion concentration near the working electrode surface becomes more uniform with the increase in its surface area. The larger electrode area results in the narrower current density distribution. Therefore, the uniformity of the copper-ion consumption rate at the electrode surface is improved by increasing the electrode area, which is expected to realize uniform electroplated copper films.