Presentation Information
[PS-03-03]Mitigating TSV-Induced Stress Using Novel Candle-type Hybrid TSV
〇SEKI HONG1,2, Jimyoung Lee1,2, Seung Kyu Kim1,2, Jongwook Jeon1, Kee-Won Kwon1 (1. The Univ. of Sungkyunkwan (Korea), 2. Corp. Samsung electronics (Korea))