[PS-04] 04: Power / High‐speed Devices and Materials

[PS-04-09] A Surge-Robust Packaging Reinforcement Method for SiC MPS Diodes Using Ag Bonding Metal Foil

〇Zheng Hu^1,2, Yidan Tang¹, Zhen Dong^1,2, Wenlong Liu^1,2, Lu Cao^1,2, Xinyu Liu¹ (1. Institute of Microelectronics, Chinese Academy of Sciences (China), 2. School of Microelectronics, University of Chinese Academy of Sciences (China))