2025 International Conference on Solid State Devices and Materials
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Session Details

Short Courses

[SC2]State-of-the-arts ULSI technologies: Materials, Processes, Devices, and Integration

Mon. Sep 15, 2025 12:55 PM - 4:45 PM JST
Mon. Sep 15, 2025 3:55 AM - 7:45 AM UTC
312 & 311, 3rd Floor
Organizer: Osamu Nakatsuka (Nagoya Univ.)
12:55 PM - 1:00 PM JST(3:55 AM - 4:00 AM UTC)

[SC2-OP]Opening Remarks

1:00 PM - 1:35 PM JST(4:00 AM - 4:35 AM UTC)

[SC2-01]The Future of CMOS: Facing the Limits of Scaling with the Promise of 2D Materials

〇Devin Verreck1 (1. imec)
1:35 PM - 2:10 PM JST(4:35 AM - 5:10 AM UTC)

[SC2-02]TBD

〇Koji Nii1 (1. TSMC)
2:10 PM - 2:45 PM JST(5:10 AM - 5:45 AM UTC)

[SC2-03]Next-Generation Memory Devices: 3D and Beyond-3D Integration, Applications to New Fields, and Sustainability

〇Tomoya Sanuki1 (1. KIOXIA)
2:45 PM - 3:00 PM JST(5:45 AM - 6:00 AM UTC)

[SC2-Break]Break

3:00 PM - 3:35 PM JST(6:00 AM - 6:35 AM UTC)

[SC2-04]Beyond Transistor Scaling: Maximizing Chip Utilization and Connectivity with Wafer Bonding Technologies

〇Tetsu Ohtou1 (1. TEL)
3:35 PM - 4:10 PM JST(6:35 AM - 7:10 AM UTC)

[SC2-05]Engineering the Interface: Metal/Semiconductor Contact Technology from Si-FETs to the More-Than-Moore Era

〇Philippe Rodriguez1 (1. CEA-Leti)
4:10 PM - 4:45 PM JST(7:10 AM - 7:45 AM UTC)

[SC2-06]Chiplet Integration Technology

〇Yoichiro Kurita1 (1. Science Tokyo)
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