Presentation Information
[B-6-01 (Invited)]High-density and Low-power 3D DRAM technology by Oxide-semiconductor Channel Transistor DRAM (OCTRAM)
〇Fumiya Kimura1, Takamitsu Ochi1, Tsuyoshi Sugisaki1, Takanori Akita1, Isamu Ujiie1, Sota Mochizuki1, Masayoshi Iwayama1, Atsuko Sakata1, Shinji Miyano1, Takafumi Masuda1, Kazuki Eshiro1, Tomomasa Ueda1, Nobuyoshi Saito1, Keiji Ikeda1, Mutsumi Okajima1 (1. KIOXIA Corp. (Japan))
