[K-1] 3D Integration and Stress Optimization

2:00 PM - 2:15 PM JST(5:00 AM - 5:15 AM UTC)

[K-1-03] Development of a Stress Suppression Liner Formed from a Negative Thermal Expansion Material for Through-Silicon Via (TSV) Applications

〇Yiqing Xu¹, Ruobo Lan¹, Hisashi Kino¹ (1. Kyushu Univ. (Japan))