2026 International Conference on Solid State Devices and Materials
Advanced Search

Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[K-1]3D Integration and Stress Optimization

Tue. Sep 15, 2026 1:15 PM - 2:45 PM JST
Tue. Sep 15, 2026 4:15 AM - 5:45 AM UTC
Room K(108, 1st Floor)
Session Chair:Katsuhiko Suzuki(Samsung Japan Corp.), Daisuke Ikeno(KIOXIA Corp.)
1:15 PM - 1:45 PM JST(4:15 AM - 4:45 AM UTC)

[K-1-01 (Invited)]Perspectives of CoSn kagome metal as anisotropic conductor for advanced interconnects

〇Tomoya Nakatani1 (1. NIMS (Japan))
1:45 PM - 2:00 PM JST(4:45 AM - 5:00 AM UTC)

[K-1-02]Investigation of Laser-Induced Crack Deflection in Through-Glass Vias

〇Wei Feng1, Yusuke Takei1, Takeshi Kobayashi1 (1. Natl. Inst. Adv. Indus. Sci. & Tech. (Japan))
2:00 PM - 2:15 PM JST(5:00 AM - 5:15 AM UTC)

[K-1-03]Development of a Stress Suppression Liner Formed from a Negative Thermal Expansion Material for Through-Silicon Via (TSV) Applications

〇Yiqing Xu1, Ruobo Lan1, Hisashi Kino1 (1. Kyushu Univ. (Japan))
2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)

[K-1-04]Development of the Underfill with Negative Thermal Expansion Materials to Suppress Local Thermal Stress in 3D ICs

〇RUOBO LAN1, Yiqing Xu1, Hisashi Kino1 (1. Kyushu Univ. (Japan))
2:30 PM - 2:45 PM JST(5:30 AM - 5:45 AM UTC)

[K-1-05]Investigation of Thermal Warpage of Thinned Foundry Chips in Multichip to Wafer 3D Integration

〇Sota Koyama1, Yuki Sakamoto1, Hiroki Nakamura1, Takafumi Fukushima1,2, Tetsu Tanaka1,2 (1. Department of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku Univ. (Japan), 2. Department of Biomedical Engineering, Graduate School of Biomedical Engineering, Tohoku Univ. (Japan))
Back to Category List