[K-1] 3D Integration and Stress Optimization

2:15 PM - 2:30 PM JST(5:15 AM - 5:30 AM UTC)

[K-1-04] Development of the Underfill with Negative Thermal Expansion Materials to Suppress Local Thermal Stress in 3D ICs

〇RUOBO LAN¹, Yiqing Xu¹, Hisashi Kino¹ (1. Kyushu Univ. (Japan))

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