[K-2] Novel Materials and Advanced Process Technologies

4:00 PM - 4:15 PM JST(7:00 AM - 7:15 AM UTC)

[K-2-02] Self-Activated Wafer Bonding with Ultra-thin ALD Films for BSPDN Integration

〇Taisuke Yamamoto¹, Hayato Kitagawa¹, Hyuga Ishii¹, Ryota Ogata¹, Jenyu Lee², Minho Oh², Shuntaro Machida², Kazuhiro Yuasa², Fumihiro Inoue¹ (1. Yokohama National Univ. (Japan), 2. KOKUSAI ELECTRIC Corp. (Japan))