[K-2] Novel Materials and Advanced Process Technologies | 2026 International Conference on Solid State Devices and Materials

Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[K-2]Novel Materials and Advanced Process Technologies

Tue. Sep 15, 2026 3:30 PM - 5:15 PM JST
Tue. Sep 15, 2026 6:30 AM - 8:15 AM UTC

Room K(108, 1st Floor)

Session Chair:Mayumi B. Takeyama(Kitami Inst. of Technology), Takashi Matsumoto(Tokyo Electron Technology Solutions Ltd.)

3:30 PM - 4:00 PM JST(6:30 AM - 7:00 AM UTC)

[K-2-01 (Invited)]The properties of SnO₂ as a channel layer for advanced semiconductor device

〇Hyeongtag Jeon¹ (1. Hanyang Univ. (Korea))

4:00 PM - 4:15 PM JST(7:00 AM - 7:15 AM UTC)

[K-2-02]Self-Activated Wafer Bonding with Ultra-thin ALD Films for BSPDN Integration

〇Taisuke Yamamoto¹, Hayato Kitagawa¹, Hyuga Ishii¹, Ryota Ogata¹, Jenyu Lee², Minho Oh², Shuntaro Machida², Kazuhiro Yuasa², Fumihiro Inoue¹ (1. Yokohama National Univ. (Japan), 2. KOKUSAI ELECTRIC Corp. (Japan))

4:15 PM - 4:30 PM JST(7:15 AM - 7:30 AM UTC)

[K-2-03]Extreme memory hole diameter shrinkage for High Aspect Ratio via patterning

〇Daniel Montero¹, Senne Fransen¹, Kruti Trivedi¹, Igor Belov¹, Mattia Pasquali¹, Murat Pak¹, Jeongsoo Kim¹, Geert van den Bosch¹, Christophe Lorant¹, Maarten Rosmeulen^1,2 (1. imec (Belgium), 2. KU Leuven (Belgium))

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)

[K-2-04]Atomic Layer Deposition of MoSi/Mo for Low-resistivity Contacts in Advanced Logic and DRAM Applications

Yuan Li¹, Sam Zhu², Yufeng Zhuang², Shuliang Lv², 〇Xun Gu² (1. Fudan Univ. (China), 2. AMEC (China))

4:45 PM - 5:00 PM JST(7:45 AM - 8:00 AM UTC)

[K-2-05]Particle-Free Metal-Complex Inks for Low-Temperature Printed Electronics

〇Lingying Li¹, Wanli Li², Takeo Minari¹ (1. NIMS (Japan), 2. Jiangnan University (China))

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[K-2-06]Investigation of Deposition-dependent Electrical Resistivity of Indium Wires for Cryogenic Interconnects in Quantum Computing Applications

〇Yuki Sakamoto¹, Yuji Kato¹, Sota Koyama¹, Hiroki Nakamura¹, Hisashi Kino³, Takafumi Fukushima^1,2, Tetsu Tanaka^1,2 (1. Department of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku University (Japan), 2. Department of Biomedical Engineering, Graduate School of Biomedical Engineering, Tohoku University (Japan), 3. Department of Information Electronics, Faculty of Information Science and Electrical Engineering, Kyushu University (Japan))

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