Presentation Information

[PS-03-01]Innovative Fine-Pitch Bonding Process via DLP 3D-Printed Masks for High-Aspect-Ratio Cu-Pin Packaging

〇Jihoon Kim1, Jin-Heong Yim1, Young Soo Ko1, Hong Kyoon Choi1, Sukeun Yoon1 (1. Kongju National Univ. (Korea))