2026 International Conference on Solid State Devices and Materials
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Mon. Sep 14, 2026
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[PS-03-01]
Innovative Fine-Pitch Bonding Process via DLP 3D-Printed Masks for High-Aspect-Ratio Cu-Pin Packaging
〇Jihoon Kim
1
, Jin-Heong Yim
1
, Young Soo Ko
1
, Hong Kyoon Choi
1
, Sukeun Yoon
1
(1. Kongju National Univ. (Korea))
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