2026 International Conference on Solid State Devices and Materials
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Session Details

Poster Session03: Heterogeneous and 3D Integration / Interconnect / MEMS

[PS-03]Heterogeneous and 3D Integration / Interconnect / MEMS

Wed. Sep 16, 2026 3:00 PM - 5:00 PM JST
Wed. Sep 16, 2026 6:00 AM - 8:00 AM UTC
Poster Hall（Convention Hall 3+4）(Convention Hall 3+4, 2nd Floor)

[PS-03-01]Innovative Fine-Pitch Bonding Process via DLP 3D-Printed Masks for High-Aspect-Ratio Cu-Pin Packaging

〇Jihoon Kim1, Jin-Heong Yim1, Young Soo Ko1, Hong Kyoon Choi1, Sukeun Yoon1 (1. Kongju National Univ. (Korea))

[PS-03-02]Controlling Glass Microchannel Surface Morphology via Atmospheric Pressure Plasma Surface Modification and HCl Etching

〇Nobuya Mineyuki1, Yasuo Hayashi2, Seiichiro Higashi1 (1. Hiroshima Univ. (Japan), 2. AGC Inc. (Japan))

[PS-03-03]Low-Temperature Depth-Uniform SiC Coating of MWCNT Forests by Vinylsilane Thermal CVD for CNT-Sheet Electrode Applications

〇Jiajin Wang1, Naoto Oshima1, Kenichi Uehara2,3, Yasuo Nakai4, Shinya Fukuchi4, Shigeo Yasuhara2, Wakana Takeuchi1 (1. Aichi Inst. of Tech. (Japan), 2. Japan Advanced Chemicals Ltd. (Japan), 3. Tohoku Univ. (Japan), 4. Koatsu Gas Kogyo Co., Ltd. (Japan))

[PS-03-04]High-Performance Ferroelectric negative capacitance FinFET with solid-solution HZO Gate Stack for Low-Power RF Applications

〇Cheng-Yueh Cheng1, Chun-Wei Wu1, Chia-Yi Lin1, Chao-Wei Wu1, Yueh-Chun Wu1, Fu-Ju Hou3, Hsin-Hui Hu2, Yung-Chun Wu1 (1. National Tsing Hua University (Taiwan), 2. National Taipei University of Technology (Taiwan), 3. Taiwan Semiconductor Research Institute (Taiwan))

[PS-03-05]Atomic Layer Etching of Molybdenum Thin Films for Nanoscale Interconnect Patterning

〇Hong Ju Yang1, Hojin Chung1, Daehan Won1, In-Hwan Baek1, Chee Won Chung1 (1. INHA University (Korea))

[PS-03-06 (Late News)]Temperature Distribution Measurement of an On-State GaN-HEMT Device in Lateral and Depth Directions using Raman Thermometry

〇Kensuke Sagawa1, Takuya Hoshii1, Anton Myalitsin2,3, Hiroyuki Ryoson2, Hitoshi Wakabayashi4, Takashi Yoda2, Takayuki Ohba2, Kuniyuki Kakushima1 (1. School of Eng., Science Tokyo (Japan), 2. WOW Alliance, Science Tokyo (Japan), 3. ANVOS Analytics Cor., Ltd. (Japan), 4. Inst. of Integrated Res., ScienceTokyo (Japan))

[PS-03-07 (Late News)]Control of Crystallinity and Preferred Orientation of TiN Films
for Electrode Applications

〇Masaru Sato1, Mayumi B. Takeyama1 (1. Kitami Inst. of Tech. (Japan))

[PS-03-08 (Late News)]Signal and Power Integrity Co-Analysis of a High-Speed System-in-Package with Through-Silicon Interposer for Logic-Memory Integration

Yeong-Lin Lai1, 〇Wen-Jung Chiang1 (1. National Changhua University of Education (Taiwan))
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