[PS-03] Heterogeneous and 3D Integration / Interconnect / MEMS

[PS-03-06] Atomic Layer Etching of Molybdenum Thin Films for Nanoscale Interconnect Patterning

〇Hong Ju Yang¹, Hojin Chung¹, Daehan Won¹, In-Hwan Baek¹, Chee Won Chung¹ (1. INHA University (Korea))