[SO-PS-03] Heterogeneous and 3D Integration / Interconnect / MEMS

1:38 PM - 1:40 PM JST(4:38 AM - 4:40 AM UTC)

[SO-PS-03-05] Redeposition-free Atomic Layer Etching of Cobalt Nanopatterns Using Ethylenediamine/Ar Plasma for Next-Generation Interconnect Fabrication

〇Daehan Won¹, Hongju Yang¹, Hojin Chung¹, Minsuk Sung², Chee Won Chung¹, In-Hwan Baek¹ (1. Inha Univ. (Korea), 2. R&D Center, Tanhay Inc. (Korea))