[SO-PS-03] Heterogeneous and 3D Integration / Interconnect / MEMS | 2026 International Conference on Solid State Devices and Materials

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Short Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[SO-PS-03]Heterogeneous and 3D Integration / Interconnect / MEMS

Wed. Sep 16, 2026 1:30 PM - 1:42 PM JST
Wed. Sep 16, 2026 4:30 AM - 4:42 AM UTC

Room K(108, 1st Floor)

Session Chair:Mayumi B. Takeyama(Kitami Inst. of Technology), Yoshiyuki Oba(Sony Semiconductor Manufacturing Corp.)

1:30 PM - 1:32 PM JST(4:30 AM - 4:32 AM UTC)

[SO-PS-03-01]Innovative Fine-Pitch Bonding Process via DLP 3D-Printed Masks for High-Aspect-Ratio Cu-Pin Packaging

〇Jihoon Kim¹, Jin-Heong Yim¹, Young Soo Ko¹, Hong Kyoon Choi¹, Sukeun Yoon¹ (1. Kongju National Univ. (Korea))

1:32 PM - 1:34 PM JST(4:32 AM - 4:34 AM UTC)

[SO-PS-03-02]Controlling Glass Microchannel Surface Morphology via Atmospheric Pressure Plasma Surface Modification and HCl Etching

〇Nobuya Mineyuki¹, Yasuo Hayashi², Seiichiro Higashi¹ (1. Hiroshima Univ. (Japan), 2. AGC Inc. (Japan))

1:34 PM - 1:36 PM JST(4:34 AM - 4:36 AM UTC)

[SO-PS-03-03]Low-Temperature Depth-Uniform SiC Coating of MWCNT Forests by Vinylsilane Thermal CVD for CNT-Sheet Electrode Applications

〇Jiajin Wang¹, Naoto Oshima¹, Kenichi Uehara^2,3, Yasuo Nakai⁴, Shinya Fukuchi⁴, Shigeo Yasuhara², Wakana Takeuchi¹ (1. Aichi Inst. of Tech. (Japan), 2. Japan Advanced Chemicals Ltd. (Japan), 3. Tohoku Univ. (Japan), 4. Koatsu Gas Kogyo Co., Ltd. (Japan))

1:36 PM - 1:38 PM JST(4:36 AM - 4:38 AM UTC)

[SO-PS-03-04]High-Performance Ferroelectric negative capacitance FinFET with solid-solution HZO Gate Stack for Low-Power RF Applications

〇Cheng-Yueh Cheng¹, Chun-Wei Wu¹, Chia-Yi Lin¹, Chao-Wei Wu¹, Yueh-Chun Wu¹, Fu-Ju Hou³, Hsin-Hui Hu², Yung-Chun Wu¹ (1. National Tsing Hua University (Taiwan), 2. National Taipei University of Technology (Taiwan), 3. Taiwan Semiconductor Research Institute (Taiwan))

1:38 PM - 1:40 PM JST(4:38 AM - 4:40 AM UTC)

[SO-PS-03-05]Redeposition-free Atomic Layer Etching of Cobalt Nanopatterns Using Ethylenediamine/Ar Plasma for Next-Generation Interconnect Fabrication

〇Daehan Won¹, Hongju Yang¹, Hojin Chung¹, Minsuk Sung², Chee Won Chung¹, In-Hwan Baek¹ (1. Inha Univ. (Korea), 2. R&D Center, Tanhay Inc. (Korea))

1:40 PM - 1:42 PM JST(4:40 AM - 4:42 AM UTC)

[SO-PS-03-06]Atomic Layer Etching of Molybdenum Thin Films for Nanoscale Interconnect Patterning

〇Hong Ju Yang¹, Hojin Chung¹, Daehan Won¹, In-Hwan Baek¹, Chee Won Chung¹ (1. INHA University (Korea))

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