[SO-PS-03] Heterogeneous and 3D Integration / Interconnect / MEMS

1:40 PM - 1:42 PM JST(4:40 AM - 4:42 AM UTC)

[SO-PS-03-06] Atomic Layer Etching of Molybdenum Thin Films for Nanoscale Interconnect Patterning

〇Hong Ju Yang¹, Hojin Chung¹, Daehan Won¹, In-Hwan Baek¹, Chee Won Chung¹ (1. INHA University (Korea))