Session Details
[A-1]DTCO
Tue. Sep 15, 2026 1:15 PM - 3:00 PM JST
Tue. Sep 15, 2026 4:15 AM - 6:00 AM UTC
Tue. Sep 15, 2026 4:15 AM - 6:00 AM UTC
Room A(Convention Hall 1, 2rd Floor)
Session Chair:Kuniyuki Kakushima(Institute of Science Tokyo), Genji Nakamura(Tokyo Electron Ltd.)
[A-1-01 (Invited)]Holistic System and Technology Co-Optimization for High-Performance Edge AI Computing Platforms
〇Youseok Suh1, Jie Deng1, Jun Yuan1, Frank Yang1, Jihong Choi1, Milind Shah1, Pranjal Srivastava1, Giri Nallapati1, PR. Chidi Chidambaram1 (1. Qualcomm (USA))
[A-1-02]DTCO Investigation of Self-Aligned Backside-Contact Monolithic CFET with BM0-signal and M0-power Routing at Standard-Cell-Library Level
〇Yuxuan Wang1, Yaoping Xiao1, Jinhyun Chun1, Masaharu Kobayashi1 (1. The University of Tokyo (Japan))
[A-1-03]Enhancing SRAM Design with A Novel Staggered-Gate CFET: A Path to Area Reduction and Performance Optimization
〇Xin Wang1,2, Longyu Sun1,2, Haoyan Liu1,2, Yongliang Li1,2 (1. State Key Lab. of Fabrication Technologies for Integrated Circuits, Inst. of Microelectronics of the Chinese Academy of Sciences (China), 2. School of Integrated Circuits, Univ. of Chinese Academy of Sciences (China))
[A-1-04]Self-Heating Characterization and Thermal Network Modeling of Sequential CFET with Backside Power Delivery Network
〇Taoyu Zhou1, Naiqi Liu1, Yandong He1, Gang Du1,2 (1. Peking Univ. (China), 2. Beijing Innovation Center of Integrated Circuits Lab. (China))
[A-1-05]A DTCO Examination and Optimization on PowerVia Technology on GAA
〇Chuangxin Zhou1, Feiyu Teng1, Xiangyu Yan1, Rui Guo1, Ziqiao Xu1, Runsheng Wang1, Ming Li1, Heng Wu1 (1. Peking University (China))
[A-1-06]Geometry-Dependent Thermal Network Model for Flip-FET
〇Naiqi Liu1, Taoyu Zhou1, Yandong He1, Gang Du1 (1. School of Integrated Circuits, Peking Univ. (China))
