講演情報
[22p-P04-18]Precise Junction Temperature Setting for Reliability Test of Chip-Scale Semiconductor Packages
〇Byongjin Ma1, Taehee Jung1, Sungsoon Choi1, Jemin Kim1, Kwanhun Lee1 (1.KETI)
キーワード：
Junction temperature、reliability test、thermal resistance
In order to estimate an accurate lifetime of semiconductor packages, precise junction temperature setting is essential. Thermal resistance model in the semiconductor packages is useful and widely used to set the junction temperature during the reliability tests. By measuring the temperature at the solder point located on the surface of printed circuit board and using the thermal resistance (Rth_js) between the junction point and the solder point, we could estimate the junction temperature roughly during the reliability tests.
Small semiconductor packages such as chip-scale package (CSP) LEDs have been widely adopted. However, in the case of CSPs, it is very difficult to define the solder-points because of their small package size. And this problem has led to the measurement inaccuracy of the LED junction temperature.
Instead of the inaccurate solder-point temperature (Ts) in the CSPs, reproducible board temperature (Tb) and the thermal resistance (Rth_jb) between the junction and the bottom of the PCB are proposed. We can extract the thermal resistance (Rth_jb) precisely using a thermal-transient tester. And we could set the junction temperature (Tj) by choosing the board temperature (Tb) during reliability tests such as a high-temperature test and a high-temperature and high-humidity test.
This work ((P0026115) was supported in part by the Ministry of Trade, Industry and Energy in Korea.
Small semiconductor packages such as chip-scale package (CSP) LEDs have been widely adopted. However, in the case of CSPs, it is very difficult to define the solder-points because of their small package size. And this problem has led to the measurement inaccuracy of the LED junction temperature.
Instead of the inaccurate solder-point temperature (Ts) in the CSPs, reproducible board temperature (Tb) and the thermal resistance (Rth_jb) between the junction and the bottom of the PCB are proposed. We can extract the thermal resistance (Rth_jb) precisely using a thermal-transient tester. And we could set the junction temperature (Tj) by choosing the board temperature (Tb) during reliability tests such as a high-temperature test and a high-temperature and high-humidity test.
This work ((P0026115) was supported in part by the Ministry of Trade, Industry and Energy in Korea.