講演情報
[15a-PB1-5]Transient Thermal Response-Based Non-Destructive Failure Analysis for Through-Glass Vias
〇Byongjin Ma1, Juhee Baek1, Guesuk Lee1, Jemin Kim1 (1.KETI)
キーワード：
non-destructive、failure analysis、TGV
Advanced 2.5D and 3D packaging technologies have been adopted to enhance the performance of AI semiconductors, where the redistribution layer (RDL) and interposer play a critical role in yield and reliability. Glass interposers have emerged as promising alternatives to silicon interposers due to their scalability and superior electrical properties, but their brittleness and limitations in through-glass via (TGV) processes require high-speed, full inspection of defects such as delamination, cracks, and voids. This study proposes a non-contact, thermally driven inspection method based on transient thermal response analysis using infrared thermography. The feasibility of the proposed approach is quantitatively verified through three-dimensional heat transfer simulations considering conduction, convection, and radiation.