[22605-07] Session F2

4:00 PM - 4:20 PM JST(7:00 AM - 7:20 AM UTC)

[22605-07-03] Improving The Appearance Defects of The Solder Protected Process

*Closer Lai¹, Shuh-Chih Chang¹, Chang-Fang Wang¹, Chuen-Sheng Cheng² (1. Unimicron Technology Corp., Taoyuan City, Taiwan (Taiwan) (Taiwan), 2. Department of Industrial Engineering and Management, Yuan-Ze University (Taiwan))

Keywords:

solder,DMAIC,FTA,analysis of variance