Session Details
[22605-07]Session F2
Wed. Sep 18, 2024 3:20 PM - 4:20 PM JST
Wed. Sep 18, 2024 6:20 AM - 7:20 AM UTC
Wed. Sep 18, 2024 6:20 AM - 7:20 AM UTC
Room F(12-209)
[22605-07-01]A Study of Process Parameter Recommendation Based on Machine Learning Optimization Techniques for IC Tray Manufacturing
Chien-Chih Wang1, *Chi-Ying Pao1, Chia-Hui Yang1 (1. Ming Chi University of Technology (Taiwan))
[22605-07-02]Applying DOE to Reduce the Placement Defectives in EBD Process
*Shih-An Ma1, Zi-hyao Lan1, Miso Wei1, Chuen-Sheng Cheng2 (1. Unimicron Technology Corp., Taoyuan City, Taiwan (Taiwan), 2. Department of Industrial Engineering and Management, Yuan-Ze University (Taiwan))
[22605-07-03]Improving The Appearance Defects of The Solder Protected Process
*Closer Lai1, Shuh-Chih Chang1, Chang-Fang Wang1, Chuen-Sheng Cheng2 (1. Unimicron Technology Corp., Taoyuan City, Taiwan (Taiwan) (Taiwan), 2. Department of Industrial Engineering and Management, Yuan-Ze University (Taiwan))