Presentation Information
[22608-10-02]Optimizing the Bump Process by Response Surface Methodology
*Sean Wang1, Sean Guo1, Chien-Yi Wang1, Vincent Huang1, Chuen-Sheng Cheng2 (1. Unimicron Technology Corp. (Taiwan), 2. Department of Industrial Engineering and Management, Yuan Ze University (Taiwan))
Keywords:
carrier,bump,Response Surface Methodology,Monte Carlo method