Session Details

[Tu-2A]FinFET and Trench Interfaces

Tue. Sep 29, 2026 10:40 AM - 12:30 PM JST
Tue. Sep 29, 2026 1:40 AM - 3:30 AM UTC
Oral-A(1st Floor, G7+G8)
Chair:Edward Robert Van Brunt(onsemi, USA), Takuji Hosoi(National Institute for Materials Science, Japan)

[Tu-2A-01]Unique Threshold-Voltage Behavior in SiC n-Channel FinFETs with Fin Widths from 26 to 530 nm

*Eiji Kagoshima1, Aiko Ichimura1, Hitoshi Fujioka1, Jun Saito1, Tsuyoshi Nishiwaki1, Hirokazu Fujiwara1, Tsunenobu Kimoto2 (1. MIRISE Technologies Corp. (Japan), 2. Kyoto Univ. (Japan))

[Tu-2A-02]Demonstration of a SiC P-Channel FinFET with Enhanced Mobility

*Shion Toshimitsu1, Eiji Kagoshima2, Hirokazu Fujiwara2, Kyota Mikami1, Mitsuaki Kaneko1, Tsunenobu Kimoto1 (1. Kyoto Univ. (Japan), 2. MIRISE Technologies Corp. (Japan))

[Tu-2A-03]Separated Source Sum-Difference (S3D) Extraction Method for Accurate Trench Sidewall Mobility Evaluation in SiC Trench MOSFETs

*Leming Jiao1,2, Yu-Chieh Chien1, Zijie Zheng1,2, Xiaolin Wang1,2, Runze Wang1, Weijie Wang1, Abdul Hannan Yeo1, Qin Gui Voo1, Liyuan Liu1, Xinghua Wang1, Umesh Chand1, Xiao Gong1,2, Navab Singh1, Yee Chia Yeo1,2 (1. Inst. of Microelectronics (IME), A*STAR (Singapore), 2. National Univ. of Singapore (Singapore))

[Tu-2A-04]Unveiling Face-Dependent Mobility-Limiting Scattering Mechanisms in 4H-SiC Trench Sidewall Channels

*Xiaolin Wang1,2, Yu-Chieh Chien1, Leming Jiao1,2, Zijie Zheng1,2, Weijie Wang1, Runze Wang1, Xinghua Wang1, Abdul Hannan Yeo1, Qin Gui Voo Roth1, Liyuan Liu1, Umesh Chand1, Xiao Gong1,2, Navab Singh1, Yee Chia Yeo1,2 (1. Inst. of Microelectronics (IME), A*STAR (Singapore), 2. National Univ. of Singapore (Singapore))

[Tu-2A-05]Mobility Enhancement Mechanism of 4H-SiC Trench Sidewall
MOS Channels Evaluated by 3D-VDP

*Kana Hiramatsu1, Hirohisa Hirai1, Eiji Kagoshima2, Mitsuru Sometani1, Keisuke Nagaya1, Jun Saito2, Takaya Shimono2, Tsuyoshi Nishiwaki2, Hirokazu Fujiwara2, Mitsuo Okamoto1 (1. National Inst. of Advanced Indus. Science and Technology (AIST) (Japan), 2. MIRISE Technologies Corp. (Japan))