[14p-P02-1~20] 6.4 Thin films and New materials

[14p-P02-1] Fabrication and characteristics of Cu thin films by mist CVD

〇(M1)Tatsuki Okada¹, Ryousuke Ohashi¹, Tatsuya Yasuoka, Toshiyuki Kawaharamura^1,2, Htet Su WAI^1,2 (1.Kochi University of Technology, 2.Research Inst)

Keywords:

copper

Metal thin films are mainly used for wiring in electronic devices and are formed by methods that provide vacuum equipment such as sputtering and evaporation. On the other hand, the mist CVD method being developed in this laboratory is used to form Ag and Cu under atmospheric pressure, but the mechanism of the mist CVD metal thin film formation has not yet been clarified. In this experiment, the thin film properties of Cu were investigated under different conditions.