[15a-K509-1~6] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[15a-K509-4] Efficient method for predicting liquid film flow during spin coating

〇(M1)Kotaro Yamaoka¹, Koichi Sawada², Taichi Takashima², Yoshinori Takagi², Takehiro Sano³, Takeshi Saruwatari², Takashi Ikeuchi³, Suguru Shiratori¹ (1.Tokyo City Univ., 2.SCREEN Holdings Co., Ltd., 3.SCREEN Advanced System Solutions Co., Ltd.)

Keywords:

semiconductor,wafer cleaning,liquid film flow

This report describes a simulation method for liquid film flow in the wafer cleaning process of semiconductor manufacturing. In the process, where cleaning liquid is applied by scanning a nozzle over a fast-rotating wafer, conventional two-phase flow simulations like the Volume of Fluid (VOF) method are inefficient. To solve this problem, we propose two methods: reducing the equations using the lubrication approximation and using Physics-Informed Neural Networks (PINNs) to learn the equations with machine learning. The effectiveness of these methods is discussed by comparing them with experimental results.