The 72nd JSAP Spring Meeting 2025
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Presentation Information

1:35 PM - 2:05 PM JST(4:35 AM - 5:05 AM UTC)

[15p-K101-2]Packaging Technology for Advanced Semiconductors

〇Katsuaki Suganuma1 (1.Flexible 3D System Integration Laboratory, SANKEN, Osaka University)

Keywords:

packaging,advanced semiconductor,chiplet

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