The 72nd JSAP Spring Meeting 2025
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Session Details

Symposium (Oral)Symposium : 【Open Symposium】A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

[15p-K101-1~9](Open Symposium) A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

Sat. Mar 15, 2025 1:30 PM - 5:30 PM JST
Sat. Mar 15, 2025 4:30 AM - 8:30 AM UTC
K101 (Lecture Hall Bldg.)
Keizo Kinoshita(AIO Core), Fumihiro Inoue(YNU)
1:30 PM - 1:35 PM JST(4:30 AM - 4:35 AM UTC)

[15p-K101-1]Opening Remarks

〇Jiro Ida1,2 (1.Kanazawa Inst. of Tech., 2.Chief Secretary of Silicon Technology Division)
Comment()
1:35 PM - 2:05 PM JST(4:35 AM - 5:05 AM UTC)

[15p-K101-2]Packaging Technology for Advanced Semiconductors

〇Katsuaki Suganuma1 (1.Flexible 3D System Integration Laboratory, SANKEN, Osaka University)
Comment()
2:05 PM - 2:35 PM JST(5:05 AM - 5:35 AM UTC)

[15p-K101-3]Chip-Package Interaction on High Bandwidth Memory (HBM)

〇Naoki Yokoi1 (1.Micron Memory Japan)
Comment()
2:35 PM - 3:05 PM JST(5:35 AM - 6:05 AM UTC)

[15p-K101-4]Theramal-aware Device Design of Integrated MOS Transistors

〇Ken Uchida1 (1.Univ. Tokyo)
Comment()
3:05 PM - 3:35 PM JST(6:05 AM - 6:35 AM UTC)

[15p-K101-5]2.xD/3D Integration & Packaging Technology

〇Yoichiro Kurita1 (1.Institute of Science Tokyo)
Comment()
3:55 PM - 4:25 PM JST(6:55 AM - 7:25 AM UTC)

[15p-K101-6]Packaging Technologies for Photonics and Electronics Convergence Devices

〇Hideyuki Nasu1 (1.Furukawa Electric)
Comment()
4:25 PM - 4:55 PM JST(7:25 AM - 7:55 AM UTC)

[15p-K101-7]Mass Production Achievements and Future Prospects of OKI's Proprietary CFB Technology for Heterogeneous Integration

〇Takahito Suzuki1 (1.OKI)
Comment()
4:55 PM - 5:25 PM JST(7:55 AM - 8:25 AM UTC)

[15p-K101-8]Trends in in-vehicle equipment and their mounting and packaging structures for the evolution of mobility

〇Toshihiro Miyake1 (1.I-VPR)
Comment()
5:25 PM - 5:30 PM JST(8:25 AM - 8:30 AM UTC)

[15p-K101-9]Closing Remarks

〇Osamu Nakatsuka1,3, Katsura Miyashita2,3 (1.Nagoya Univ., 2.Toshiba Electronic Devices & Storage, 3.Deputy Chief Secretary of Silicon Technology Division)
Comment()
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