[15p-K101-1~9] (Open Symposium) A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

2:05 PM - 2:35 PM JST(5:05 AM - 5:35 AM UTC)

[15p-K101-3] Chip-Package Interaction on High Bandwidth Memory (HBM)

〇Naoki Yokoi¹ (1.Micron Memory Japan)

Keywords:

DRAM,HBM,High Bandwidth Memory

HBM (high bandwidth memory) is high speed, large capacity and low power consumption a DRAM (dynamic random access memory) product, which is configures SiP (system in package) together with a processor. In this presentation, features, configuration and manufacturing process of HBM are overviewed and challenges in manufacturing HBM, such as external force at die stacking, thermal budget and die / wafer warp, are discussed from the view point of silicon process.