[15p-K101-1~9] (Open Symposium) A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

3:55 PM - 4:25 PM JST(6:55 AM - 7:25 AM UTC)

[15p-K101-6] Packaging Technologies for Photonics and Electronics Convergence Devices

〇Hideyuki Nasu¹ (1.Furukawa Electric)

Keywords:

Photonics-Electronics Convergence,Co-Packaged Optics

The bandwidth of switch ASICs has been doubling every two years in a datacenter. It is also reported that the bandwidth required for AI/ML has been rapidly expanding, at 35 times in two years. Switch ASICs and GPUs used in AI/ML consume a large amount of power. Therefore, while there is a demand for larger capacity optical links as the bandwidth expands, there are concerns about increased power consumption. As a result, the adoption of CPO, as the first stage of photonics-electronics convergence technologies, has been expected. In this presentation, In this presentation, the packaging technologies of photonics-electronics convergence devices will be focused.