[15p-K101-1~9] (Open Symposium) A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

4:25 PM - 4:55 PM JST(7:25 AM - 7:55 AM UTC)

[15p-K101-7] Mass Production Achievements and Future Prospects of OKI's Proprietary CFB Technology for Heterogeneous Integration

〇Takahito Suzuki¹ (1.OKI)

Keywords:

heterogenious integration,CFB

Introduce OKI's unique heterogeneous integration technology, "Crystal Film Bonding (CFB)," which was successfully mass-produced for the first time in the world in 2006. Then, describe the efforts to enhance the added value of analog semiconductors by leveraging the features of CFB through open and innovative activities with various partners. Finally, outline the future prospects that CFB aims to achieve.