[15p-K101-1~9] (Open Symposium) A la carte Packaging Technologies II: Advanced Semiconductor Packaging Technologies and Those Future Prospects

4:55 PM - 5:25 PM JST(7:55 AM - 8:25 AM UTC)

[15p-K101-8] Trends in in-vehicle equipment and their mounting and packaging structures for the evolution of mobility

〇Toshihiro Miyake¹ (1.I-VPR)

Keywords:

mobility,in-vehicle equipment,packaging structure

Mobility technology is evolving toward CASE (Connected, Autonomous, Shared & Service, Electric). For C, A, and S, in-vehicle equipment will require high-capacity calculations and high speeds, and the challenges will be ensuring the reliability of the large SoC (System On Chip) package mounting area and high heat dissipation structure. For E, in-vehicle equipment will be smaller and have higher output density, and the challenges will be miniaturizing the logic circuits, power circuits, and entire electric circuits.