[16a-K508-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[16a-K508-6] The effect of degassing on void expansion suppression in the hybrid bonding.

〇Ayato Ohgata¹, Ayako Kawanishi¹, Ippei Kume¹, Arita Koji¹, Hideyuki Yamawaki¹ (1.KIOXIA)

Keywords:

Hybrid Bonding,3D NAND,Void