[16a-K508-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)

[16a-K508-7] Characterization of SiCN Bonding Mechanisms for Hybrid Bonding

〇Taisuke Yamamoto¹, Hayato Kitagawa¹, Ryosuke Sato¹, Sodai Ebiko¹, Tomohiro Sakata², Fumihiro Inoue¹ (1.YOKOHAMA Nat.Univ., 2.Toray Research Center)

Keywords:

hybrid bonding