[16a-K508-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

11:00 AM - 11:15 AM JST(2:00 AM - 2:15 AM UTC)

[16a-K508-8] Surface Characterization for Bonding Dynamics in Wafer Bonding

〇Ryota Ogata¹, Ryosuke Sato¹, Hayato Kitagawa¹, Sodai Ebiko¹, Fumihiro Inoue¹ (1.YOKOHAMA Nat. Univ.)

Keywords:

hybrid bonding,bond wave