[16p-K205-1~10] Frontiers in Low-Power Semiconductor Technologies: Paving the Way for Carbon Neutrality

3:50 PM - 4:05 PM JST(6:50 AM - 7:05 AM UTC)

[16p-K205-7] Study on 3D chiplets with excellent heat dissipation using high thermal conductivity insulator AlN film

〇Takeshi Takagi¹, Takeki Ninomiya¹, Masaaki Niwa¹, Tadahiro Kuroda¹ (1.The Univ. of Tokyo)

Keywords:

semiconductor,AlN,heat dissipation

Various 3DIC technologies have been developed to achieve high performance and low power consumption, but the increase in energy density has caused serious problems with temperature rise inside the chip. We have proposed the "Cool 3D Chiplet" that uses AlN, a high thermal conductivity insulator, as TSV insulator, inter-layer insulator, and inter-chip insulator to efficiently dissipate heat generated inside the chip to the outside. In this study, we investigated the effect of reducing CO₂ emissions by improving the heat dissipation of 3DIC.