[16p-P02-1~7] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[16p-P02-7] Effects of gas flow and bias voltage on surface roughness in PCVM

〇Tomoyuki Tanaka¹, Mamoru Ohkubo¹, Shunichiro Matsuzaka¹, Masahiko Kanaoka¹, Masanori Tsujioka¹ (1.JTEC Corporation)

Keywords:

plasma etching,NC-processing

PCVM can machine global shapes of work with nm precision, but the surface roughness can't improve highly efficient. Thus, it is essential that surface roughness does not deteriorate by plasma exposure before and after PCVM processing. In this paper, the effects of the gas flow in plasma and bias voltage on surface roughness were investigated with the aim of suppressing the surface roughness deterioration caused by PCVM processing.