The 73rd JSAP Spring Meeting 2026

This symposium provides an overview of atomic layer processes (ALP), including atomic layer deposition (ALD) and atomic layer etching (ALE), whose importance is rapidly increasing in advanced semiconductor device manufacturing, covering both characterization and applications. The morning program is an English session featuring six invited talks by leading researchers from abroad. Topics span high-temperature selective ALD, new paradigms for 3D device fabrication, process analysis using ultra-high-aspect-ratio structures, in situ diagnostics, and plasma-based ALE, offering an integrated discussion of “depositing, etching, and measuring.”

In the afternoon, the program begins with two contributed presentations in English, followed by a Japanese session consisting of three invited talks and eight contributed talks. The invited talks will outline future directions of ALP, including its role in advanced 3D nanodevices, the development of high-purity gallium precursors for atomic layer deposition, and atomic-scale processing toward quantum applications. The contributed talks will showcase a broad range of recent results, from low-damage ALE, selective growth, and higher-throughput processing to reaction analysis and process optimization using approaches such as KMC and NNP.