Presentation Information
[2P32]Transient evolution of target erosion profile in high power pulsed magnetron sputtering processes
*Ren Mori1, Md. Suruz Mian2, Takeo Nakano1 (1. Department of Science and Technology, Seikei University, 2. School of Engineering, Tokai University)
TWe investigated the evolution of the erosion track profile formed on target surfaces during the high power pulsed magnetron sputtering (HPPMS). The results were compared with the previous study for DC magnetron sputtering (dcMS) cases. In dcMS, it was found that the normalized erosion profiles narrowed over time. In this study, copper targets of 75 mm diameter were sputtered using HPPMS with duty ratios of 2.5%, 5.0%, and 10%, at 1.0 Pa of Ar gas pressure, 200 Hz of frequency, and 100 W of average power. Erosion profiles were measured using a height gauge. Results showed that HPPMS produced significantly broader erosion profiles than DC sputtering, and the smaller the duty ratio (the higher peak power), the wider the profile. This suggests that plasma expansion during high-power pulses leads to a broader ion incidence profile. Additionally, FWHM narrowing in HPPMS occurred later compared to dcMS, reflecting a relationship between discharge volume and the groove size.