[1B06-07] Plasma Science & Technology (PST)

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)

[1B07] Effect of Magnetron Sputtering Conditions on TiZrV Coating Deposited Using a Compact NEG-Coating Device

*Ruau Watanabe¹, Yasunori Tanimoto^1,2, Jin Xiuguang^1,2, Takashi Uchiyama², Takashi Nogami², Tohru Honda² (1. The Graduate University for Advanced Studies, SOKENDAI (Japan), 2. The High Energy Accelerator Research Organization, KEK (Japan))

To realize NEG-coating in vacuum chambers with complex geometries, we have developed a compact flange-mountable magnetron sputtering device using a cylindrical TiZrV-alloy target and a periodically arranged permanent-magnet array. TiZrV films were deposited in a DN63 cross tube under various sputtering conditions to investigate the effects of sputtering-gas flow and magnet arrangement. The deposited films showed fine-grained surface morphology and columnar cross-sectional structure, and the activated NEG-coated duct achieved a base pressure in the 10^-10 Pa range without breaking vacuum. A lower sputtering pressure resulted in a smaller thickness difference between two measurement positions than a higher pressure, whereas only a marginal difference was observed between balanced and unbalanced-type magnetron configurations. These results provide useful information for optimizing the coating process using the compact NEG-coating device.

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