Session Details

[AS-1]State-of-the-art Chiplet Design Technologies

Wed. Sep 10, 2025 1:45 PM - 3:00 PM JST
Wed. Sep 10, 2025 4:45 AM - 6:00 AM UTC
Building for General Education (A/B/C) 3F A32(Okayama University)
Chair:Takashi Matsumoto

[AS-1-01]The Cutting Edge of 3D-IC and Chiplet Design: Accelerating Advanced Packaging with Cadence’s Integrated Solutions

〇Toru Makii1 (1. Cadence Design Systems)

[AS-1-02]Efficient Wiring Layout for UCIe to Realize Low-cost and Chiplet-type Package Substrate

〇Soshi Shimomura1, Yutaka Uematsu1, Katusya Kikuchi1, Haruo Shimamoto1, Yuuki Araga1, Shinichi Ouchi1 (1. National Institute of Advanced Industrial and Science Technology)

[AS-1-03]AI chip Design Center Design Environment and Operation

〇Atsushi Hasegawa1, Makoto Ikeda1, Yasushi Igarashi2, Ichiro Naka2, Kunio Uchiyama2 (1. The University of Tokyo, 2. National Institute of Advanced Industrial Science and Technology)