Presentation Information

[A-1-01 (Invited)]3D stacked devices and MOL innovations for post-Nanosheet CMOS scaling

〇Steven Demuynck1、Victor Vega Gonzalez1、Camila Toledo1、Karen Stiers1、Cassie Sheng1、Andy Peng1、Dmitry Batuk1、Maryam Hosseini1、Anne Vandooren1、Lucas Lima1、Naoto Horiguchi1、Serge Biesemans1 (1. imec (Belgium))

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