Presentation Information
[A-1-04]Low-Thermal Budget Activation for 3D Integration by Green Nanosecond Laser
〇Hongxu Liao1, Yandong Ge1, Haixia Li1, Lanyi Xie2, Qing Wang1, Ming Li1,3, Ru Huang1,3 (1. School of Integrated Circuits, Peking University (China), 2. Department of Energy and Resources Engineering, Peking University (China), 3. Beijing Advanced Innovation Center for Integrated Circuits (China))