2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI
International Conference on Solid State Devices and Materials
2024 International Conference on Solid State Devices and Materials

2024 International Conference on Solid State Devices and Materials

Sep 1 - Sep 4, 2024Arcrea HIMEJI

[A-6-01 (Invited)]Milli-Kelvin Analysis Revealing the Role of Band-edge States in Cryogenic MOSFETs

〇Hiroshi Oka1, Hidehiro Asai1, Takumi Inaba1, Shunsuke Shitakata1, Hitoshi Yui1, Hiroshi Fuketa1, Shota Iizuka1, Kimihiko Kato1, Takashi Nakayama1, Takahiro Mori1(1. National Institute of Advanced Industrial Science and Technology (AIST) (Japan))
https://doi.org/10.7567/SSDM.2024.A-6-01
We performed drain current–gate voltage (ID–VG) characterization of bulk Si n-MOSFETs at deep cryogenic temperatures down to 15 mK to clarify the role of band-edge states. From the temperature-dependent subthreshold swing (SS) characterization, we found that the saturated SS at a few Kelvins decreased again in the milli-Kelvin range in proportion to temperature. Theoretical analysis of the temperature-dependent SS revealed that the exponentially distributed localized immobile states at the band-edge govern ID–VG characteristics at cryogenic temperatures, in which the occupancy of band-edge states is a key parameter for cryogenic MOSFETs. This study provides deep insights into the physical understanding of Si MOS-based devices under cryogenic operation, that is, both cryogenic CMOS and silicon qubits.