Presentation Information
[C-1-03]CFET-compatible Backside Connection using Dual-Damascene Integration Scheme comparing W versus Mo Metallization
〇Anne Vandooren1, Stefaan Van Huylenbroeck1, Tanushree Sarkar1, Thomas Chiarella1, Anshul Gupta1, Michele Stucci1, Liesbeth Witters1, Jan Willlem Maes2, Camila Toledo de Carvalho Cavalcante1, Harinarayanan Puliyalil1, Farid Sebaai1, Koen D'have1, Nancy Heylen1, Sujan Kumar Sarkar1, Andrea Mingardi1, Serena Iacovo1, Pallavi Puttarame Gowda1, Anabela Veloso1, Nicolas Jourdan1, Michael Givens2, Sujith Subramanian1, Steven Demuynck1, Naoto Horiguchi1, Zsolt Tokei1, Serge Biesemans1, Chiyu Zhu 3, Harsh Vardhan Bana 2, Hameeda Jagalur Basheer 2 (1. imec (Belgium), 2. ASM Leuven (Belgium), 3. ASM Helsinki (Finland))