Session Details
[C-1]Advanced Metallization I
Mon. Sep 2, 2024 2:30 PM - 3:45 PM JST
Mon. Sep 2, 2024 5:30 AM - 6:45 AM UTC
Mon. Sep 2, 2024 5:30 AM - 6:45 AM UTC
Room C (409)(4th Floor)
Session Chair: Wei Feng (AIST), Takashi Matsumoto (Tokyo Electron Technology Solutions Ltd.)
[C-1-01 (Invited)]Area Selective Deposition to Facilitate Integration
〇Christophe Vallee1, Anthony Valenti1, Nicolas Paul Maldonado1, Van Long Nguyen1, shivan Antar1, Gregory Denbeaux1, Carl Jr Ventrice1, Marceline Bonvalot2 (1. University at Albany (United States of America), 2. Universite Grenoble Alpes (France))
[C-1-02]Intercalated Multilayer Graphene / Nickel Hybrid Conductor for RF Device Scaling
〇Kazuyoshi Ueno1, Kouta Masukawa1, Shinichi Tanaka1 (1. Shibaura Inst. of Tech. (Japan))
[C-1-03]CFET-compatible Backside Connection using Dual-Damascene Integration Scheme comparing W versus Mo Metallization
〇Anne Vandooren1, Stefaan Van Huylenbroeck1, Tanushree Sarkar1, Thomas Chiarella1, Anshul Gupta1, Michele Stucci1, Liesbeth Witters1, Jan Willlem Maes2, Camila Toledo de Carvalho Cavalcante1, Harinarayanan Puliyalil1, Farid Sebaai1, Koen D'have1, Nancy Heylen1, Sujan Kumar Sarkar1, Andrea Mingardi1, Serena Iacovo1, Pallavi Puttarame Gowda1, Anabela Veloso1, Nicolas Jourdan1, Michael Givens2, Sujith Subramanian1, Steven Demuynck1, Naoto Horiguchi1, Zsolt Tokei1, Serge Biesemans1, Chiyu Zhu 3, Harsh Vardhan Bana 2, Hameeda Jagalur Basheer 2 (1. imec (Belgium), 2. ASM Leuven (Belgium), 3. ASM Helsinki (Finland))
[C-1-04]Tungsten Carbide Hard Mask Performance in Supervia and High Aspect Ratio Patterning for BEOL Advanced Interconnects
〇Daniel Montero1, Philippe Marien1, Yannick Hermans1, Fulya Ulu Okudur1, Mattia Pasquali1, Syamashree Roy1, Chen Wu1, Nunzio Buccheri1, Victor Vega-Gonzalez1, Harinarayanan Puliyalil1, Quyang Lin1, Gilberto Casillas1, Jef Geypen1, Alfonso Sepulveda1, Frederic Lazzarino1, Seongho Park1, Zsolt Tokei1 (1. imec (Belgium))