Presentation Information
[C-4-04]Optimization of Plasma Dicing Process for Die to Wafer Hybrid Bonding
〇Violeta Georgieva1, Filip Schleicher2, Ye Lin1, Samuel Suhard1, Anne Jourdain1, Edward Walsby2, Il Gyo Koo1, Frederic Lazarino1, Gerald Beyer1, Eric Beyne1 (1. IMEC (Belgium), 2. KLA-Tencor (UK))