[C-4] Advanced integration | 2024 International Conference on Solid State Devices and Materials

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Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[C-4]Advanced integration

Tue. Sep 3, 2024 10:45 AM - 12:00 PM JST
Tue. Sep 3, 2024 1:45 AM - 3:00 AM UTC

Room C (409)(4th Floor)

Session Chair: Masayuki Kitamura (KIOXIA Corp.), Yoshiyuki Ohba (Sony Semiconductor Manufacturing Corp.)

10:45 AM - 11:15 AM JST(1:45 AM - 2:15 AM UTC)Invited

[C-4-01 (Invited)]Backside Power Delivery Process Integration Challenges

〇Liesbeth Witters¹、Peng Zhao¹、Gerald Beyer¹、Eric Beyne¹ (1. imec (Belgium))

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[C-4-02]Development of Hybrid Bonding Using Area-Selective Passivation Layer Deposition Technology on Various Substrates for Heterogeneous Integrated Structure

〇Wen-Tzu Tsai¹, Mu-Ping Hsu¹, Yi-Hsuan Chen¹, Yuan-Chiu Huang¹, Kuan-Neng Chen¹ (1. National Yang Ming Chiao Tung Univ. (Taiwan))

11:30 AM - 11:45 AM JST(2:30 AM - 2:45 AM UTC)

[C-4-03]Large-Area Single-Crystal Ge Using Elevated Epitaxy Technique for Monolithic 3D Integration

〇Yu-Ming Pan^1,2, Huan-Yu Chiu¹, Nien-Chih Lin², Hao-Tung Chung¹, Bo-Jheng Shih¹, Chiao-Yen Wang¹, Chih-Chao Yang², Po-Tsang Huang¹, Chang-Hong Shen², Po-Jung Sung², Wen-Fa Wu², Kuan-Neng Chen¹, Chenming Hu^1,3 (1. National Yang Ming Chiao Tung University (Taiwan), 2. Taiwan Semiconductor Research Institute (Taiwan), 3. University of California, Berkeley (United States of America))

11:45 AM - 12:00 PM JST(2:45 AM - 3:00 AM UTC)

[C-4-04]Optimization of Plasma Dicing Process for Die to Wafer Hybrid Bonding

〇Violeta Georgieva¹, Filip Schleicher², Ye Lin¹, Samuel Suhard¹, Anne Jourdain¹, Edward Walsby², Il Gyo Koo¹, Frederic Lazarino¹, Gerald Beyer¹, Eric Beyne¹ (1. IMEC (Belgium), 2. KLA-Tencor (UK))

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