2024 International Conference on Solid State Devices and Materials
Sep 1 - Sep 4, 2024Arcrea HIMEJI
2024 International Conference on Solid State Devices and Materials
Sep 1 - Sep 4, 2024Arcrea HIMEJI
[C-5-03]Material Parameter Extraction Method at Low Temperature With Simple Measurement and 3D Electromagnetic Analysis
〇Taiga Fukumori1,2, Norinao Kouma1,2, Yoshiyasu Doi1,2, Shintaro Sato1,2(1. Fujitsu Ltd. (Japan), 2. RIKEN Center for Quantum Computing (Japan))
High-density wiring at low temperature is required for development of superconducting quantum computers. We fabricate a printed circuit board and extract the material parameters at low temperature (3K). We develop a simple method for extracting material parameters using relatively long cables in a vacuum refrigerator. The conductivity at low temperature is estimated to be ~10 times larger (6 × 108 (S/m)) than that at room temperature at 5 GHz and 3 times (2 × 108 (S/m)) larger than that at 20 GHz.