[C-5] Advanced Metallization II | 2024 International Conference on Solid State Devices and Materials

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Session Details

Oral Presentation03: Heterogeneous and 3D Integration / Interconnect / MEMS

[C-5]Advanced Metallization II

Wed. Sep 4, 2024 9:00 AM - 10:00 AM JST
Wed. Sep 4, 2024 12:00 AM - 1:00 AM UTC

Room C (409)(4th Floor)

Session Chair: Xun Gu (ASM Japan), Takashi Matsumoto (Tokyo Electron Technology Solutions Ltd.)

9:00 AM - 9:15 AM JST(12:00 AM - 12:15 AM UTC)

[C-5-01]Stabilization of Liquid-Vapor Two-Phase Flow Boiling in Microchannel by Manifold with Flow Diode Structure for Advanced Thermal Management

〇Hongyuan SHI¹, Paul BRUAND², Ryoto YANAGISAWA¹, Laurent JALABERT^1,2, Soo Hyeon KIM^1,2, Masahiro NOMURA¹ (1. IIS, The Univ. of Tokyo (Japan), 2. LIMMS/IIS-CNRS, The Univ. of Tokyo (Japan))

9:15 AM - 9:30 AM JST(12:15 AM - 12:30 AM UTC)

[C-5-02]From design to manufacturing: new methods to fix the mechanical problems associated with device production

〇Lionel VIGNOUD¹, Benjamin VAVRILLE³, Laurent Luc CHAPELON³, Rafael ESTEVEZ² (1. Univ. Grenoble Alpes, CEA, Leti (France), 2. Univ. Grenoble Alpes, Laboratoire SIMaP (France), 3. STMicroelectronics (France))

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[C-5-03]Material Parameter Extraction Method at Low Temperature With Simple Measurement and 3D Electromagnetic Analysis

〇Taiga Fukumori^1,2, Norinao Kouma^1,2, Yoshiyasu Doi^1,2, Shintaro Sato^1,2 (1. Fujitsu Ltd. (Japan), 2. RIKEN Center for Quantum Computing (Japan))

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[C-5-04]Introduction of thick AlN coating on Si for 3D-IC thermal management

〇Takeki Ninomiya¹, Takeshi Takagi¹, Masakazu Mori², Masaaki Niwa¹, Tadahiro Kuroda¹ (1. The Univ. of Tokyo (Japan), 2. Ryukoku Univ. (Japan))

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