2024 International Conference on Solid State Devices and Materials
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Sun. Sep 1, 2024
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5:00 PM - 5:15 PM JST
(8:00 AM - 8:15 AM UTC)
[M-2-03]
Nondestructive Evaluation of Thermal-Process-Induced Change of Sn/Cu/Ni Plating Thin Film Stacks Based on EDX Measurement and Bayesian Inference
〇Yutaka Hoshina
1
(1. Sumitomo Electric Industries, Ltd. (Japan))
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DOI:
https://doi.org/10.7567/SSDM.2024.M-2-03
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